发明名称 |
Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias |
摘要 |
A method for forming a through-via in a laminated substrate by laser drilling the through-via in a laminated substrate from a top exposed surface of the substrate to a bottom exposed surface of the substrate using a plurality of laser pulses that are trepanned in a first predetermined pattern. Each pulse trepanned in the first predetermined pattern has a first energy density per pulse. Then, the through-via is laser drilled using a plurality of laser pulses that are trepanned in a second predetermined pattern. Each pulse trepanned in the second predetermined pattern has a second energy density per pulse that is greater than the first energy density per pulse. The second predetermined pattern is within the first predetermined pattern.
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申请公布号 |
US6203891(B1) |
申请公布日期 |
2001.03.20 |
申请号 |
US20000507821 |
申请日期 |
2000.02.22 |
申请人 |
W. L. GORE & ASSOCIATES, INC. |
发明人 |
NODDIN DAVID B. |
分类号 |
B23K26/00;B23K26/38;H01L21/48;H01L23/12;H01L23/538;H05K3/00;H05K3/40;H05K3/42;H05K3/46;(IPC1-7):B32B3/00 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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