| 发明名称 |
Modular semiconductor workpiece processing tool |
| 摘要 |
The present invention provides for a semiconductor workpiece processing tool. The semiconductor workpiece processing tool includes an interface section comprising at least one interface module and a processing section comprising a plurality of processing modules for processing the semiconductor workpieces. The semiconductor workpiece processing tool has a conveyor for transferring the semiconductor workpieces between the interface modules and the processing modules.
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| 申请公布号 |
US6203582(B1) |
申请公布日期 |
2001.03.20 |
| 申请号 |
US19960680068 |
申请日期 |
1996.07.15 |
| 申请人 |
SEMITOOL, INC. |
发明人 |
BERNER ROBERT W.;WOODRUFF DANIEL J.;SCHMIDT WAYNE J.;COYLE KEVIN W.;ZILA VLADIMIR;LUND WORM |
| 分类号 |
H01L21/677;B65G49/07;C25D7/12;H01L21/00;(IPC1-7):H01L21/00;H01L21/64 |
主分类号 |
H01L21/677 |
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