发明名称 |
Corrosion-free multi-layer conductor |
摘要 |
A corrosion resistant, multi-layer structure on a substrate including an adhesion metallic layer on the substrate, a cushion metallic layer on the adhesion layer, a diffusion barrier layer on the cushion layer, and an impermeable gold layer that encapsulates all the layers, is substantially even on all sides of the layers, and contacts a region on the substrate adjacent the layers to prevent oxidation and corrosion.
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申请公布号 |
US6203926(B1) |
申请公布日期 |
2001.03.20 |
申请号 |
US19990473142 |
申请日期 |
1999.12.28 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
AHMAD UMAR MOEZ UDDIN;BHATIA HARSARAN SINGH;BHATIA SATYA PAL SINGH;DALAL HORMAZDYAR MINOCHER;PRICE WILLIAM HENRY;PURUSHOTHAMAN SAMPATH |
分类号 |
H01L21/203;C23C14/04;C23C28/02;H01L21/48;H01L21/52;H01L23/12;H01L23/498;H05K1/09;H05K3/14;H05K3/24;(IPC1-7):H01L29/12;B32B15/04 |
主分类号 |
H01L21/203 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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