发明名称 Corrosion-free multi-layer conductor
摘要 A corrosion resistant, multi-layer structure on a substrate including an adhesion metallic layer on the substrate, a cushion metallic layer on the adhesion layer, a diffusion barrier layer on the cushion layer, and an impermeable gold layer that encapsulates all the layers, is substantially even on all sides of the layers, and contacts a region on the substrate adjacent the layers to prevent oxidation and corrosion.
申请公布号 US6203926(B1) 申请公布日期 2001.03.20
申请号 US19990473142 申请日期 1999.12.28
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 AHMAD UMAR MOEZ UDDIN;BHATIA HARSARAN SINGH;BHATIA SATYA PAL SINGH;DALAL HORMAZDYAR MINOCHER;PRICE WILLIAM HENRY;PURUSHOTHAMAN SAMPATH
分类号 H01L21/203;C23C14/04;C23C28/02;H01L21/48;H01L21/52;H01L23/12;H01L23/498;H05K1/09;H05K3/14;H05K3/24;(IPC1-7):H01L29/12;B32B15/04 主分类号 H01L21/203
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