| 摘要 |
In an electronic unit which comprises a heat source, is supported in a casing, and should be kept below an allowable temperature, a movable heat sink is brought into thermal contact with the heat source and an external heat sink of the casing. Preferably, the movable heat sink is movable into and out of the thermal contact with the heat source and is slidably guided by a guide member of the casing. More preferably, a resilient thermal conductive member is interposed between the heat source and the movable heat sink.
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