发明名称 Method of formation in a silicon wafer of an insulated well
摘要 A method of forming an insulated well in an upper portion of a silicon substrate, including the steps of providing a structure of silicon-on-insulator type including a silicon substrate, an insulating layer, and a thin single-crystal silicon layer; removing the insulating layer and the thin silicon layer outside locations where the insulated well is desired to be formed; growing an epitaxial layer; performing a planarization; and making a vertical insulating wall above the periphery of the maintained portion of the thin insulating layer.
申请公布号 US6204098(B1) 申请公布日期 2001.03.20
申请号 US19990426221 申请日期 1999.10.22
申请人 STMICROELECTRONICS S.A. 发明人 ANCEAU CHRISTINE
分类号 H01L21/20;H01L21/316;H01L21/32;H01L21/762;(IPC1-7):H01L21/00;H01L21/336 主分类号 H01L21/20
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