| 摘要 |
Disclosed is a bump designed to certainly moderate a thermal stress applied between a semiconductor device and a printed circuit board and enhance the strength of a bonding portion without use of a sealing resin, and a method of manufacturing the bump. The bump includes a relatively elastic first ball bump formed on an electrode pad provided on a semiconductor device; and a second ball bump formed in such a manner as to be overlapped on the first ball bump at least in the direction perpendicular to the electrode pad. The second ball bump is different in material or composition from the first ball bump and is adapted to be in contact with an eutectic solder pre-coated on a connection land of a printed circuit board. |
