| 摘要 |
The invention concerns a method for making electronic micromodules including at least an antenna comprising the following steps: producing electronic circuits in the form of integrated circuits (7) from a first substrate wafer (6); producing antennae on said substrate wafer (1), in particular by etching strip conductors whereof the ends form bond sites; inserting an insulator between the two wafers (1, 6) and assembling them; cutting the two assembled wafers (1, 6) around the integrated circuits; transferring each resulting assembly onto electrical contact pads (8a, 8b) optionally borne by a support (9), the bonding sites (3a, 3b) of the antenna above the contact pads (a, 8b); and connecting the bond sites (3a, 3b) of the antenna to the integrated circuit (7) via the contact pads (8a, 8b). |
