SEMICONDUCTOR CHIP PACKAGE AND METHOD FOR FABRICATING THE SAME

摘要

PURPOSE: A semiconductor chip package and a method for fabricating the same are provided to reduce a fabricating cost of a semiconductor chip package having a structure of a chip scale package by using raw materials and subsidiary materials. CONSTITUTION: A semiconductor chip(1) is adhered to a center portion of an upper face of an insulating plate(11) for frame(10) by using an adhesive(3). A multitude of conductive patterns(13) for lead are formed on a bottom face of the insulating plate(11). A wire bonding region of the conductive patterns(13) exposed within passing holes(12) of the insulating plate(11). Bonding pads of the semiconductor chip(1) are electrically connected with the conductive patterns(13), which is exposed within the passing holes(12) by a bonding wire(5). The semiconductor chip(1) is molded by an encapsulant(7).