METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE THEREOF

摘要

PURPOSE: A method for fabricating a semiconductor package and a semiconductor package thereof are provided to mount a plurality of semiconductor chips by using a lead-on-chip method. CONSTITUTION: A plurality of semiconductor chip(64) is mounted on a TAB tape(60). The TAB tape(60) is formed with a base film(69) and a metal line pattern(63). A device hole(67) is formed in a center portion of the base film(69). The metal line pattern(63) is formed on the base film(69) of both side of the device hole(67). A connection hole(66) for exposing an outer lead(68) is formed at both sides of the device hole(67). An inner lead(61) is arranged on the device hole(67). An outer lead(68) is connected with the inner lead(61). A metal bump(62) is formed by dropping a melted solder into the inner lead(61). The metal bump(62) is formed with the first metal bump(62a) and the second metal bump(62b). An electrode bump(65) is adhered to the metal bump(62) of the inner lead(61).