| 摘要 |
PURPOSE:To provide a chip-size electronic part and the manufacture of the electronic part. CONSTITUTION:A film carrier 23 is stuck to the surface of a chip 22. An opening 41 to expose the pad on the surface of the chip 22 is made in the film carrier 23. A frame 25 is made around this opening, and synthetic resin 26 is applied to the inside of this frame 25 so as to seal a pad, a wire, etc. Moreover, a bump 24 is made by mounting a solder ball on the pad of the circuit pattern 50 of the film carrier 23, and heating this solder ball and fusing and solidifying it. |
