发明名称
摘要 PROBLEM TO BE SOLVED: To provide a link prepd. by injection molding wherein filling density of a resin is large and internal stress in the molded body is relaxed and warpage is little. SOLUTION: A link is prepd. by means of a mold consisting of a fixed mold 31 and a movable mold 32 forming a cavity 33 with a link shape in such a way described below. At first, the fixed mold 31 and the movable mold 32 are clamped under low pressure. Then, by injecting a molten resin into the cavity 33, the molten resin is filled therein while the vol. of the cavity 33 is increased by opening a little the fixed mold 31 and the movable mold 32. Successively, by clamping the fixed mold 31 and the movable mold 32 under high pressure, excess molten resin in the cavity 33 is returned backward and a gate 47 is shutted down and the molten resin in the cavity 33 is furthermore compressed.
申请公布号 JP3146473(B2) 申请公布日期 2001.03.19
申请号 JP19960081741 申请日期 1996.04.03
申请人 发明人
分类号 B29C33/42;B29C45/26;B29C45/28;B29C45/56;B29C45/70;B29L31/00;(IPC1-7):B29C45/28 主分类号 B29C33/42
代理机构 代理人
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