发明名称 |
Metallisierung für Polymerdielektrikum-Multichipmodule |
摘要 |
Multilayer circuit devices include a plurality of metallized patterns thereon, said patterns being separated by a polymeric dielectric film. The various metallized patterns are interconnected by means of microvias through the polymeric film or films. Each of the metallizations is a composite including in succession from the substrate or from the polymeric film, a layer of titanium (Ti), a layer of titanium and palladium alloy (Ti/Pd), a layer of copper (Cu), and a layer of titanium and palladium alloy (Ti/Pd). The Ti-Ti/Pd-Cu-Ti/Pd composite is hereinafter referred to as TCT. The adhesion between the polymeric film and the top Ti/Pd layer is better than that between the polymer and gold (Au) and comparable to that between the polymer and an adhesion promoted Au layer. Use of the TCT metallization also results in additional cost reduction due to the elimination of Ni and Au layers on top of the Cu layer. <IMAGE> |
申请公布号 |
DE69527004(D1) |
申请公布日期 |
2002.07.18 |
申请号 |
DE1995627004 |
申请日期 |
1995.04.26 |
申请人 |
AT & T CORP., NEW YORK |
发明人 |
FRANK, AARON LEONARD;JOHNSON, DOUGLAS BRADFORD;IBIDUNNI, AJIBOLA OLUTOYIN;KRAUSE, DENNIS LYLE;NGUYEN, TRAC |
分类号 |
H05K3/46;H01L21/48;H01L23/12;H01L23/498;H01L23/538;H05K1/09;H05K3/38;(IPC1-7):H01L23/498;H01L27/01 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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