发明名称 |
A system and method for packaging integrated circuits |
摘要 |
A system and method for efficiently interconnecting a plurality of ICs, thereby improving the electrical performance of the overall system. In one embodiment of the system of the present invention, a plurality of carriers corresponds to a plurality of ICs, and a board has a plurality of board regions for receiving the plurality of ICs and are arranged so as to be attached to a backplane forming a vertical stack of boards. |
申请公布号 |
IL133091(D0) |
申请公布日期 |
2001.03.19 |
申请号 |
IL19980133091 |
申请日期 |
1998.05.22 |
申请人 |
ALPINE MICROSYSTEMS, INC. |
发明人 |
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分类号 |
H01L25/18;H01L21/60;H01L21/66;H01L23/498;H01L25/04;H01L25/065;H05K1/11;H05K1/14;H05K1/18;H05K3/34;H05K3/42;H05K3/46;(IPC1-7):H01L |
主分类号 |
H01L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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