| 摘要 |
PROBLEM TO BE SOLVED: To prevent a halo from occurring around a reference hole by a method wherein a pair of an upper and a lower reference hole out of reference holes bored in two bonding plates are set larger in diameter than a stack pin. SOLUTION: A reference hole 6 is provided to bonding plates 1, a printed wiring board 3, a heat sink 4, and a no-flow prepreg 5 respectively, and a stack pin 2 is inserted into the reference holes 6 bored in them to fix. The four reference holes 6 are provided, and two reference holes 7 out of the reference holes provided to the bonding plates 1 are set larger in diameter than the stack pin 2. By this setup, a part of the stack pin 2 is not fixed to the bonding plates 1, so that stress imposed on the inner circumferential surface of the printed wiring board 3 in a bonding operation can be relaxed, and a halo can be prevented from occurring around a reference hole provided to the printed wiring board 3.
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