发明名称 TOROIDAL COIL MOUNTING SUBSTRATE AND CIRCUIT UNIT USING THE SAME
摘要 PROBLEM TO BE SOLVED: To reduce soldering positions and the number of parts by a method wherein there is provided a cutout part comprising a protrusive locking piece for locking lead line extending a winding of a toroidal coil. SOLUTION: In a toroidal coil mounting substrate, a circuit substrate A is a power supply circuit and a circuit substrate B is an electronic circuit. The circuit substrate A is provided with a cutout 4 having a protrusion which is punched in a U shape for locking a wiring lead 6 near a position of mounting a toroidal coil. An insulation film of the wiring lead 6 at one end of the toroidal coil 1 in which a parallel insulation film copper wire 2 is wound is removed, and is soldered to terminals 3a, 3b of the circuit substrate A. Further, the wiring lead 6 of another end is extended, and the middle of the wiring lead 6 is hitched to a protrusion 5 of the U-shaped cutout to fix the toroidal coil. Furthermore, in the wiring lead 6, the insulation film of the wiring lead 6 extended to a required length between the circuit substrate A and the circuit substrate B is removed, and is soldered to terminals 12a, 12b of the circuit substrate B.
申请公布号 JP2001068345(A) 申请公布日期 2001.03.16
申请号 JP19990239793 申请日期 1999.08.26
申请人 TOKO INC 发明人 EGI YUTAKA
分类号 H01F27/28;H01F17/06;H01F27/00;H01F27/30;(IPC1-7):H01F27/00 主分类号 H01F27/28
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