| 摘要 |
PROBLEM TO BE SOLVED: To obtain a package substrate having improved electrical characteristics, while being equipped with a feeder line for electrical plating. SOLUTION: A feeder line 37a is gathered at an assembly region 39, set to each portion in a package region 71, and at the same time is connected to a planar grounding wire 36F. Electroplating to a packaging terminal 38 or the like is made by conduction through the planar grounding wire 36F and feeder lines 37a and 37b. After plating operation is completed, and the feeder line 37a is cut at the assembly region 39. After the cutting, the feeder line 37a that remains while being connected to the packaging terminal 38 functions as a stub, after the semiconductor device has been completed. By forming the feeder line 37a along a signal line 34, the feeder line 37a, that remains being connected to the planar grounding wire 36F, functions as a shield wire after the cutting. |
