| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor device in which two electronic parts having different areas and different numbers of pads for connecting terminals including electrode terminals to which connecting terminals, such as outside connecting terminals, etc., are attached are laminated in such a way that the electrode terminal forming surfaces of the parts are faced oppositely to each other and which can be reduced in size and thickness. SOLUTION: A semiconductor device is constituted by laminating a chip-size package 12 and a bare chip 14 having different areas and different numbers of pads for connecting terminals including electrode terminals to which connecting terminals, such as outside connecting terminals, etc., are attached upon another. The chip size package 12 having the larger area and the larger number of pads for connecting terminals and the bare chip 14 having the smaller area and the smaller number of pads for connecting terminals are connected to each other by flip chip bonding and linear resilient connecting terminals 22 are erected on the pads 16 for connecting terminal formed on the chip size package 12 except the pads 16 which are electrically connected to the pads for connecting terminal of the bare chip 12. |
