| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device of a structure wherein, even in the case where the device is mounted on the rear of the circuit board, dip soldering of the device or flow soldering of the device, not to mension reflow soldering of the device, can be easily performed to the rear of the board. SOLUTION: When a light-projecting part 8 of a semiconductor light-emitting device 9 is made to position in a through hole 16a formed in a circuit board 16 and the device 9 is soldered to the board 16, protruding parts 1a are formed on both sides of a substrate 1 of the device 9 or protruding parts are formed of a metal piece with the one end, which is buried in a molded material and is made to protrude from the molded material, on both sides of the substrate 1 and the device 9 is temporarily tacked and is fixed on the board 16 with a bonding agent coated on the board 16 in such a way that the protruding parts cover the hole 16a. |
