| 摘要 |
PROBLEM TO BE SOLVED: To provide a low-cost lithography process for fabrication of devices. SOLUTION: A flexible mold 20 comprises a surface 21 provided with at least one projecting surface 17 and at least one recessed surface 18 which define a pattern 21 cooperatively. A material layer 15 is formed on a semiconductor substrate 10. The mold surface 21 is brought into contact with the material layer 15 by an enough force which can adapt the layer 15 to the surface 21, while the mold 20 is brought into contact with the flat and rigid lower surface of an object 25 by the enough force which can adapt its mold surface opposite to the pattern surface to the above-mentioned lower surface. The layer 15 is cured under the condition that the layer 15 is in contact with the surface 21 and also that the mold 20 is in contact with the flat and rigid lower surface. After curing, the mold 20 is separates from the cured layer 15. As result, the relief pattern 21 which is adapted to the pattern 21 of the mold surface is transferred into the layer 15.
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