| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor device, which can reduce signal delay of a signal wiring without reducing the wiring capacity of a power supply wiring, even when the power supply wiring and signal wiring are formed of the same layer, and its manufacture. SOLUTION: This device has a 1st insulating film 60, formed on a base substrate 10, a 2nd insulating film 62 which is formed on the 1st insulating film 60 and has a dielectric constant lower than that of the 1st insulating film, a 1st wiring 84, which is embedded in the 2nd insulating film, and a 2nd wiring 86 which is embedded in the 1st and 2nd insulating films and has its reverse surface positioned in the 1st insulating film. The lower surface of the 2nd wiring is positioned below the lower surface of the 1st wiring.
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