| 摘要 |
PROBLEM TO BE SOLVED: To evaluate a flip-chip packaging process by a simple method and in a short time. SOLUTION: A process of flip-chip packaging an LSI chip with bumps on a wiring board is evaluated by: conducting a flip-chip packaging trail by using a dummy chip 1 with bumps, which is made of transparent glass and has the same size and shape as an LSI chip of a product and in which the same bumps 4 as the bumps of the product are formed on one surface in the same arrangement and via the same underlying metal film 2 as the LSI chip with bumps of the product, and visually observing the bonding portions of the trial product and their peripheral portions through the dummy chip 1 to check the positioning accuracy of bonding and the connection shapes of the bumps.
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