| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer having a discriminating character or symbol by laser marking without deteriorating any of intensity, cleanness and flatness of the wafer. SOLUTION: Each character or symbol marked on a semiconductor wafer is formed as a dot marked by lasering, the dot has a diameter 'a' of 15 to 50μm, has a depth of 'b' of 0.1 to 1.0μm, and has height of an outer ring 'c' of 0.1 to 0.5μm.
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