| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board which is excellent in conductivity, moldability, mechanical strength and adherence of a circuit to a plastic board, and pollution-free because chemicals are not used, and a manufacturing method of the circuit board. SOLUTION: In this manufacturing method of a circuit board, (a) thermoplastic resin is made a substrate, in which (b) low melting point metal and (c) metal powder are mixed to form a conductive film. After the film is mounted on a thermoplastic resin insulating board 1 which is capable of thermal fusion welding to the thermoplastic resin substrate, only the part corresponding to a specified circuit pattern is heated from the outside, and a circuit 21 of the conductive film is thermally fusion-welded to the thermoplastic resin insulating board 1, thereby forming a circuit.
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