MOUNTING METHOD OF ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To obtain an electronic component mounting method by which the gap control between an electronic component, such as a semiconductor chip and a wiring substrate and the control of flux amount can be realized simultaneously. SOLUTION: When or after a solder bump 1 is formed on an electronic component 2, a solid matter 3 with a higher fusing point than solder and a smaller diameter than the solder bump 1 and flux 4 are imbedded in the solder bump 1, and the electronic component 2 is mounted in a facedown manner on an electrode 6 of a wiring substrate 7. The solder bump 1 is fused by reflow heating in a succeeding process, so as to conduct electrical connection with the electrode 6 of the wiring substrate 7.