SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device at a low cost having a reliability higher than an iron alloy lead frame product by using a copper-plated copper alloy lead frame. SOLUTION: A polyimide adhesive 3 is used to bond a semiconductor chip 4 on a lead frame 1 obtained by copper plating a copper alloy. After electrodes of the semiconductor chip 4 and respective terminals of the lead frame 2 are connected by using wires containing gold or copper as the main ingredient, bonded portions between the semiconductor chip and wires and the lead frame and wires are resin-sealed to obtain a semiconductor device.