| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an equipment for processing a substrate which enable to suppress the decline in productivity by shortening the time required for processing with a chemical, and also enable to remove particles efficiently. SOLUTION: In a substrate processor for a single wafer cleaning process, a process (steps S1a) of discharging an ammonia hydrogen peroxide solution- mixed aqueous solution against a substrate to be processed which is being rotated, and a process (step S2a) of intermittently discharging a hydrofluoric acid against the rotating substrate, are performed. By adding the cleaning process by intermittent discharging of a hydrofluoric acid, in addition to the SC1 cleaning process, particles can be removed more efficiently.
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