发明名称 COOLING STRUCTURE OF ANTENNA DEVICE
摘要 PROBLEM TO BE SOLVED: To enable modules to be assembled or disassembled from behind an antenna device by a method wherein a pair of cooling plates where cooling liqiud flows are provided at a position to sandwich a pair of modules which supply power to an antenna element, and a pressing means is provided between the modules so as to bring them into close contact with the cooling plates. SOLUTION: A cooling structure is equipped with a coupler which feeds and exhausts a cooling liquid and cooling plates 8 where a cooling liquid is circulated inside being distributed by a manifold which collects and distributes the cooling liquid. A module 9 which releases heat as it amplifies signals and is required to be cooled down to a certain temperature or below is provided in each surface of the cooling plate 8 so as to come into close contact with it by a pressing metal 11. The module 9 can be disassembled through such a manner where the pressing metal 11 for the module 9 to replace is dismounted from behind an antenna device to disassemble the module 9 from a state where it is kept in close contact with the cooling plate 8, and then the module 9 is pulled out. Therefore, the module 9 can be disassembled or assembled from behind the antenna device.
申请公布号 JP2001068885(A) 申请公布日期 2001.03.16
申请号 JP19990236816 申请日期 1999.08.24
申请人 MITSUBISHI ELECTRIC CORP 发明人 TOKUNAGA KENJI;IIZUKA HIDETOSHI
分类号 H05K7/20;H04B1/036;(IPC1-7):H05K7/20 主分类号 H05K7/20
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