| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device, wherein wiring distance is shortened, and a method for manufacturing it, a circuit board and an electronic equipment. SOLUTION: A semiconductor device contains a board 10 wherein a wiring pattern 12 is formed on one surface thereof, and a plurality of semiconductor chips 20 and 30 that are mounted on the board 10 and connected electrically to the wiring pattern 12. A pair of parts 15 and 17 of the wiring pattern 12 are joined to each other. That is, since a pair of parts 15 and 17 of the wiring pattern 12 are joined, electrical connection is accomplished with the joint part in between. As a result, wiring distance is shortened.</p> |
