发明名称 MANUFACTURING METHOD FOR ELECTRONIC CERAMIC PART
摘要 PROBLEM TO BE SOLVED: To eliminate moisture from ceramic element by heating the ceramic element in a decreased pressure condition after such a treatment for the ceramic element as to generate adhesion or absorption of moisture. SOLUTION: Predetermined numbers of electrode printed sheets on which conductive paste for internal electrodes 1 is printed and ceramic green sheets are laminated and clamped to form a laminated and clamped unit. The laminated and clamped unit is cut in a predetermined size to make a ceramic element 5. The ceramic element 5 is sintered at a predetermined temperature. The ceramic element 5 is entered in a barrel with water or a mixture of water and polishing medium and is mingled, and surface polishing and chamfer are made. Next, the ceramic element 5 is washed by water, is heated at a predetermined temperature while vacuum chucking. Moisture which is attached on the surface of the ceramic element 5 and moisture which is absorbed inside are eliminated by evaporating. After that, conductive past is applied on the ceramic element 5 and sinter is performed to form external electrodes 4a and 4b.
申请公布号 JP2001068372(A) 申请公布日期 2001.03.16
申请号 JP19990244216 申请日期 1999.08.31
申请人 MURATA MFG CO LTD 发明人 KAWAI TAKAAKI;HIROSE HIDEO;TSUTSUMINO MASAMI
分类号 H01G4/12;H01G4/30;(IPC1-7):H01G4/12 主分类号 H01G4/12
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