| 摘要 |
PROBLEM TO BE SOLVED: To improve a joint between a metal heat-radiating plate and a printed wiring board in the heat resistance and insulation reliability. SOLUTION: An insulating plate 3 is interposed between a metal heat radiating plate 1 and a printed wiring board 2, the heat radiating plate 1 and the insulating board 3 are bonded together with an adhesive sheet 4 which is high in resin fluidity, and the insulating board 3 and the wiring board 2 are bonded together with an adhesive sheet 5 of high resin fluidity. The leads 8 of an electronic part 7 which generates heat are connected to a wiring pattern 9 formed on the opposite surface of the wiring board 2 with solder 11. By this structure, a stable joint can be obtained through the characteristics of the adhesive sheets 4 and 5, and resin does not flow out of the adhesive sheet 5, even if a hot press process is carried out under usual wiring board laminating conditions. Furthermore, the printed wiring board of this constitution can be ensured of high dielectric strength by the insulating board 3.
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