| 摘要 |
PROBLEM TO BE SOLVED: To obtain an optical module capable of being simply and surely sealed hermetically and superior in reliability. SOLUTION: A substrate 2, in which an optical fiber 31 is arranged to be optically connected to an optical semiconductor device 5, is inserted into a through-hole 6 formed on the side wall of a causing 1 for forming the optical semiconductor device 5, in a manner that the substrate 2 and the optical fiber 31 are exposed outside the casing 1; also, a low-melting point sealing member L1 is provided between one or both ends of the through-hole 6 and the optical fiber 31, while a high-melting point sealing member H1 is provided in a gap between the substrate 2 and the through-hole 6; and finally, the through-hole 6 is hermetically sealed to form the optical module M1.
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