| 摘要 |
PROBLEM TO BE SOLVED: To form a current carrying circuit without using a lead frame or a lead wire and reduce manufacturing processes, the number of component items and the manufacturing cost of a power feed component. SOLUTION: A current carrying circuit 2 is formed on a molded board 1 formed of a synthetic resin having an electric insulation property, and the current carrying circuit 2 is formed of a resin composition having electric conductivity and composed of a thermoplastic resin, metal powder or metal fiber, and a low-melting-point metal. Thereby, the need to position the current carrying circuit 2 by another structure such as a rib or boss is obviated. Therefore, increase in die manufacturing cost is restrained, and an appearance defect such as sink or warping can be prevented. Since the current carrying circuit 2 can be formed with the resin composition without using a lead frame or a lead wire, the number of component items can be reduced. Connection parts 3a, 3b to be connected to an external component 5 by being elastically deformed are formed, and components 4a, 4b for positioning the connection parts 3a, 3b are formed of the same resin composition as the current carrying circuit 2.
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