| 摘要 |
PROBLEM TO BE SOLVED: To uniformize a thickness of a material film formed on a transparent conductive film by internally embedding a film of a dielectric formed on a transparent base plate by a prescribed pattern such as a stripe, and forming the transparent conductive film in a flat shape on the transparent base plate so as to form a thin film on the film of the dielectric. SOLUTION: A film 2 of a dielectric of MgO formed on a transparent base plate 1 of alkali-free glass is formed in such a way that a photoresist is applied on the transparent base plate 1, a prescribed pattern is formed by applying a prescribed photolithoprocess to this, and afterwards, a pyrolizing method raw material of MgO is applied to this, and after drying, a remaining resist is removed, and sintering is applied. A transparent conductive film 3 is formed by being heated and sintered by applying a pyrolizing method raw material of ITO. Thus, a thin film 4 is formed on the film 2 of the dielectric. Thus, since the film 2 of the dielectric is embedded inside, the transparent conductive film 3 presents a flat surface state.
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