| 摘要 |
PROBLEM TO BE SOLVED: To provide a resist pattern superior in development residue, developability, development time, work efficiency and productivity and suitable for use in the production of a printed wiring board, a high density multilayer board, a semiconductor package, etc., and to provide a method for producing the resist pattern. SOLUTION: A photosensitive resin composition, containing (A) (A1) a photosensitive resin having a secondary hydroxyl group obtained by the addition of an unsaturated group-containing carboxylic acid to an epoxy resin or (A2) a photosensitive resin obtained by allowing a saturated or unsaturated group- containing polybasic acid anhydride to react with the secondary hydroxyl group of the photosensitive resin (A1) and (B) a photoinitiator, is applied on a substrate, dried and irradiated with actinic rays through a photomask. The unexposed part is removed with an alkali developing solution containing a basic compound, a nonionic surfactant having an HLB of 0-4, a nonionic surfactant having an HLB of 6-20 and water, to produce the object resist pattern. |
