| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device having an insert, which is easy to handle with less possibility for damaging a wafer. SOLUTION: A polishing surface plate having an open part for a laser beam to pass for chemical/mechanical polishing, a support stage for holding a wafer, a laser interferometer which generates a laser beam toward a wafer while detecting the beam reflected on the wafer, and a transparent resin insert which is transmissive provided at the open part for a laser beam to pass in the polishing surface plate, are provided.
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