METHOD FOR FORMING CARRIER FILM FOR CHEMICAL MECHANICAL POLISHING APPARATUS

摘要

PURPOSE: A method for forming a carrier film used for a chemical mechanical polishing apparatus is provided to obtain a uniform contact surface of the carrier film. CONSTITUTION: For a chemical mechanical polishing(CMP) apparatus, a carrier film(116) is attached under a rotatable carrier base(112). The carrier film(116) is then polished by a polishing pad with slurry used, so that a wafer contact surface of the carrier film(116) is made smoothly and uniformly. Preferably, a mixed solution of deionized water and potassium hydroxide is used as the slurry. A wafer(140) is supported under the carrier base(112) by a supporting ring(114) formed at lower edges of the carrier base(112), while the carrier film(116) is interposed between the carrier base(112) and the wafer(140) to absorb a mechanical shock generated therebetween.