SEAL RING FOR SEMICONDUCTOR DEVICE AND MANUFACTURE OF THE SEMICONDUCTOR DEVICE

摘要

PURPOSE: A seal ring is provided to impart improved brazing effect by having a body being soldered surely to the seal layer of a semiconductor package. CONSTITUTION: The seal ring has Cu plating(12) and Ag plating(14) applied sequentially onto the underlying surface of a seal ring body(10), comprising an iron/nickel/cobalt alloy with a thickness of 7 micrometer or smaller. When the Ag plating(14) and Cu plating(12) applied onto the seal ring body(10) are melted by heating the seal ring, an unmelten part is prevented from occurring in the Ag plating(14) and Cu plating(12) layers. The seal ring body(10) is soldered surely and hermetically to the seal layer of a semiconductor package, using silver solder produced by melting the Ag plating(14) and Cu plating(12), such that no leakage path is generated.