| 摘要 |
PURPOSE: To enhance dimensional accuracy and strength of the cumulative pitch of a connection part, etc., with an external connecting connector part or a semiconductor element of the wiring pattern of COF and TCP, without changing the bending property to conventional COF. CONSTITUTION: In a semiconductor device, in which in a base film 1 forming a wiring pattern 2 having an external connecting connector part 5, a semiconductor element or a semiconductor element 3 and a mounting part 13 except for the semiconductor element are electrically connected with a connection part 4 of wiring pattern for mounting, on an opposite plane of the base film 1 corresponding to a plane forming an external connecting connector part 5 of the base film 1, a reinforcing member 7 is provided via an adhesive layer 6 in a state, such that the base film 1 can be released from the reinforcing member 7 in an adhesive layer 6, as required. |
