发明名称 |
SYSTEM FOR DEPOSITING THIN FILM |
摘要 |
PURPOSE: A system for depositing a thin film is provided to form a pure thin film desired in a production line regardless of a processing order of respective wafers, by connecting a thin film deposition chamber and a process gas supplying parts with a plurality of process gas supplying pipes. CONSTITUTION: A thin film deposition chamber(10) forms a thin film in a specific layer of a wafer(1). A plurality of process gas supplying parts(20,30) supply predetermined process gas to the thin film deposition chamber. A plurality of process gas supplying pipes(21,31) connect the thin film deposition chamber with the respective process gas supplying parts by one-to-one correspondence.
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申请公布号 |
KR20010019991(A) |
申请公布日期 |
2001.03.15 |
申请号 |
KR19990036673 |
申请日期 |
1999.08.31 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JUN, IL HWAN;NOH, TAE HYO;PARK, BYEONG SEOK;YOON, TAE JIN |
分类号 |
H01L21/20;(IPC1-7):H01L21/20 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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