发明名称 APPARATUS FOR REFLOWING ALUMINIUM OF EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PURPOSE: An apparatus for reflowing aluminium is provided to prevent a temperature measurement value regarding a hot plate from varying by a change of a contact point and real temperature, by making a thermocouple move up and down by a bellows so that a contact can be made by a guide block at a precise portion by predetermined pressure. CONSTITUTION: A wafer is placed in a hot plate(11) supplying heat necessary for a reflow process. A heater stage(12) supports the hot plate and constitutes a part of a wall of a process chamber. A hole is formed in a part of the heater stage. A thermocouple(23) is located across the hole, and an upper end of the thermocouple is formed toward the hot plate through the hole. A thermocouple assembly(24) is connected to the heater stage to cap a lower end of the hole, and a lower end of the thermocouple is connected to the thermocouple assembly. The thermocouple assembly converts electromotive force induced by a difference of temperature at both ends of the thermocouple into a signal and indicates the signal as a temperature measurement value in a display. A portion capping the hole of the thermocouple assembly is made of a bellows(28) elasticized by a difference of atmospheric pressure at both sides of the wall. A guide block(26) guides the thermocouple. When a reflow process is performed, the bellows is reduced so that the upper end of the thermocouple contacts a predetermined portion of the hot plate by predetermined pressure.
申请公布号 KR20010019834(A) 申请公布日期 2001.03.15
申请号 KR19990036471 申请日期 1999.08.31
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE, GEON JAE
分类号 H01L21/00;(IPC1-7):H01L21/00 主分类号 H01L21/00
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