| 摘要 |
PROBLEM TO BE SOLVED: To prevent occurrence of defects during a bonding process and improve reliability of a package itself. SOLUTION: This wire bonding device is provided with a bonding tool 11 for bonding a pad 2 on a chip and a lead on a lead frame with a wire 1, the pad 2, the lead and a laser irradiation device for irradiating the bonding interface with the wire 1 with laser beams 31. This wire bonding device is provided with means for controlling an irradiation position and an irradiation angle of the laser irradiation device 21 so that the bonding interface 2a is locally heated even when the bonding interface 2a is moved at the time of bonding. Therefore, the bonding interface 2a is irradiated by laser beams 31 while being bonded. |
