发明名称 BAKE APPARATUS FOR SEMICONDUCTOR TRACK EQUIPMENT
摘要 PURPOSE: A bake apparatus for a semiconductor track equipment is provided to precisely make a wafer settled on a bake plate without a position distortion, by settling the wafer while sucking the wafer by vacuum. CONSTITUTION: A bake plate(11) heats a wafer. A plurality of elevating pins(12) has a vacuum hole(12a) on its upper surface, and is inserted into the bake plate while being capable of being elevated. A plurality of fixing pins(13) has a vacuum hole(13a) on its upper surface, and is fixed in the periphery of the elevating pins.
申请公布号 KR20010018840(A) 申请公布日期 2001.03.15
申请号 KR19990034955 申请日期 1999.08.23
申请人 HYUNDAI MICRO ELECTRONICS CO., LTD. 发明人 LEE, HYEONG SEOP
分类号 H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/68
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