METHOD FOR INSPECTING MICRO SCRATCH AND APPARATUS USING THE SAME

摘要

PURPOSE: A method for inspecting micro scratch is provided to successfully monitor the micro scratch formed on a surface of a wafer and to inspect a defect such as the micro scratch formed on a surface of a medium layer irrespective of a pattern layer. CONSTITUTION: Light is irradiated into a surface of a wafer on which a medium layer to be inspected is formed, while a light source irradiates the light by an incidence angle. A light detecting unit receives the light reflected from the surface of the wafer, and an electrical intensity signal is obtained. An electrical partial signal value regarding a reflected quantity of the light in every portions of the wafer surface is calculated from the electrical partial signal value. The electrical partial signal values are compared with each other to decide whether a defect exist on the surface of the wafer.