| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wiring board in which a previously set resistance value can be easily and stably obtained, and to provide a manufacturing method of the board. SOLUTION: A wiring board is constituted by arranging a first conductor film 20 and a second conductor film 21 which are isolated from each other on a board 1, and a resistor film 30 which is formed astride the first conductor film 20 and the second conductor film 21. Width W2 of the resistor film 30 is set larger than width W1 of the first conductor film 20 or second conductor film 21. In the widthwise direction, the resistor film 30 is protruded from the first conductor film 20 or second conductor film 21. After a conductor paste film 30A is printed, transformation due to gravity is performed by leveling treatment. Surface planarization, thinning and baking treatment of the conductor paste film 30A are performed. Thus the resistor film 30 can be formed. Since the width W2 of the resistor film 30 is increased, transformation of the conductor paste film 30A in the leveling treatment can be promoted.</p> |
