| 摘要 |
PURPOSE: A printed circuit board for a semiconductor package is provided to prevent damage of the printed circuit board or a semiconductor chip due to electrostatic discharge during an encapsulation process. CONSTITUTION: The printed circuit board(10) includes a plurality of resin layers(24) and internal circuitry patterns(22) formed between the resin layers(24). The printed circuit board(10) further has a chip mounting area(16) centrally formed on the uppermost surface of the resin layers(24), external circuitry patterns(12) radially formed around the chip mounting area(16), and a plurality of ball lands(14) formed on the lowermost surface of the resin layers(24). The internal and external circuitry patterns(22,12) and the ball lands(14) are connected respectively through via holes(13). While the external circuitry patterns(12) are covered with a solder mask(15), the ball lands(14) are exposed through the solder mask(15). In particular, the internal circuitry patterns(22) have protruded ends(22a) extended outwardly from the side edges of the resin layers(24). Therefore, the protruded ends(22a) can be in contact with inner walls of a mold while the encapsulation process is carried out.
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