| 摘要 |
PURPOSE: A cooling gas used with a self-sputtering method is provided to improve an efficiency of a plasma sputtering process by maintaining a low-pressure plasma due to helium. CONSTITUTION: A plasma sputtering reactor(10), particularly one designed for sustained self-sputtering of copper or for low-pressure sputtering, in which the pedestal(16) supporting the wafer(18) to be sputter deposited includes backside cooling or heating of the wafer through a thermal transfer gas(60), the thermal transfer gas being helium. Argon(24) is supplied to strike the plasma(38) and may be additionally supplied during operation for low-pressure sputtering.
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