UNIVERSAL SOCKET FOR BALL-GRID-ARRAY PACKAGE AND METHOD FOR TESTING PACKAGE USING THE SAME

摘要

PURPOSE: A universal socket for a ball-grid-array(BGA) package is to provide the universal socket of various types, by changing a size of a supporting unit on a test board, and by changing a size of the universal socket. CONSTITUTION: A unit(4) for supporting a package has a quadrilateral type, and is adhered to an upper surface of a test board(2) to surround a plurality of electrode pads(3) on the test board. A universal adaptor has a circular conducting material(14) formed by insulating resin(12) wherein the circular conducting material is disposed to electrically contact the plurality of electrode pads, so that universal adaptor maintains the disposition.