LEADLESS SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A leadless semiconductor package is provided to improve reliability of a solder junction between a printed circuit board and a connection pad, by forming a dummy pad on a lower surface of a substrate aside from the connection pad. CONSTITUTION: A semiconductor chip has a plurality of electrode pads. A substrate(120) has a plurality of connection pads(124) electrically connected to the semiconductor chip, mounted on the semiconductor chip and formed along an edge of a lower surface of the semiconductor chip. A resin molding part is formed by molding an upper surface of the substrate on which the semiconductor chip is mounted. At least one dummy pad(126) is formed on a lower surface of the substrate between the connection pads.