发明名称 POSITIVE CHEMICAL AMPLIFICATION TYPE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION OF RESIST PATTERN AND PRODUCTION OF ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a positive type chemical amplification type photosensitive resin composition of superior sensitivity, resolution and pattern shape, a method for producing a resist pattern of superior resolution, pattern shape, work efficiency and productivity and a method for producing an electronic device of superior resolution, pattern shape, work efficiency and productivity. SOLUTION: This photosensitive resin composition contains (a) an alkali water-soluble resin, (b) a compound which generates acid when irradiated with active actinic rays and (c) a compound having an acid decomposable group which increases solubility in the aqueous alkali solution by an acid catalyzed reaction in a side chain. The compound (b) is a sulfonic ester compound. A coating film of the photosensitive resin composition is irradiated with active actinic rays and developed to produce the object resist pattern. The photosensitive resin composition is applied and dried on the circuit forming force or protective film forming face of an electronic circuit, and the resulting coating film is irradiated with active actinic rays and developed to produce the object electronic device.
申请公布号 JP2001066774(A) 申请公布日期 2001.03.16
申请号 JP19990239110 申请日期 1999.08.26
申请人 HITACHI CHEM CO LTD;HITACHI LTD 发明人 KATO KOJI;HASHIMOTO MASAHIRO;KASUYA KEI;ARAI TADASHI;SAKAMIZU TOSHIO
分类号 H01L21/027;C08L101/00;C08L101/16;G03F7/023;G03F7/039 主分类号 H01L21/027
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