| 摘要 |
PURPOSE: Provided is a polishing pad capable of heightening the polishing efficiency through movement of abrasive particles, performing a uniform polishing, and suppressing generation of scratches on the surface polished. CONSTITUTION: A polishing pad(10) polishes a board under existence of a slurry containing polishing particles and a dispersing agent. The first layer of the pad has a polishing surface(20) and a backing surface, is formed from a fibriform or fiber component(14) existing in mixture in a polymer matrix component(16), and equipped with fibers to give a void structure to the polishing surface upon dissolution of the fibriform or fiber component in the slurry. The polishing action is made in good performance owing to additives such as a surface active agent and a remover, and the residue generated in the polishing operations can be removed, and these additives are either included in the fibriform component or added optionally upon coating the fibriform component therewith topographically.
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